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Customer Part Number or Name: |
Your unique part number of name assigned to this board. |
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Revision: |
Your letter or number for this revision. |
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Ready to Order? |
When do you think you'll be ready to order? |
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Technology: |
What component packaging technologies are you using? |
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Board Size in X Direction: |
In inches, the most extreme measurement in the X direction. |
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Board Size in Y Direction: |
In inches, the most extreme measurement in the Y direction. |
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No. of Through Hole Component Pins: |
The
number of pins on the board for through hole devices. This can be
estimated by taking the total number of component pins and multiplying
by the estimated percent (+/- 10%) of through hole pins. |
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No. of Surface Mount Component Pins: |
The
number of pins on the board for surface mount devices. This can be
estimated by taking the total number of component pins and multiplying
by the estimated percent (+/- 10%) of surface mount pins. |
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Percent of Critical Signals: |
Critical
signals are those signals that require special attention and have
attributes such as ECL, impedance control, differential pairs, guarded,
high speed, matched lengths, min/max lengths, analog and RF. Estimate
within 5% how many of the total number of signals require special
attention. The higher the percent of critical signals, the longer the
design turn time and the higher the price. |
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Finest Surface Mount Device Pitch: |
The smallest distance between surface mount device pin centers. Common distances in inches are .050, .039, .025, .020 and .016. |
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Finest Ball Grid Array Pitch: |
The smallest distance between ball grid array device pin centers. Common distances in inches are .050 and .039. |
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Board Material Type: |
Select from a material pull down list, Default is FR4. |
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Board Material Thickness: |
Select from a material pull down list, Default is .062" |
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Signal Layer Count: |
The number of layers dedicated to the routing of signals. If left open, the number of layers will be determined based on component and signal density. |
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Plane Layer Count: |
The number of layers dedicated to power and/or ground layers. If left open, the number of layers will be determined based on component and signal density. |
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Copper Weight for Signal Layers: |
The number of ounces per square foot. Default is 1 ounce. |
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Copper Weight for Plane Layers: |
The number of ounces per square foot. Default is 1 ounce. |
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Surface Plating: |
SMOBC = Solder Mask Over Bare Copper is the default. Reflow = tin lead plate under the mask. Deep Gold = Gold plating finish. |
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Gold Fingers: |
How many edges of the board will have gold fingers. |
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CNC Route Points: |
A
square pcb has 4 CNC points. Count each corner and the number of
external and internal corners or edges on the board. Cutouts typically
have 4 and narrow slots have 2. |
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No. of Surface Mount Components: |
The number of components that are attached to the board with surface mount leads. |
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Surface Mount Component Attachment: |
What sides of the board will the surface mount devices be attached to? If left open, the attachment will be determined by component and signal density. |
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No. of Through Hole Components: |
The number of components that are attached to the board with through hole pins. |
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Through Hole Component Attachment: |
What sides of the board will the through hole devices be attached to? If left open, the attachment default will be TOP side. |
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No. of Component Types (Items): |
The total number of different component types (items) on the board. |
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Quote Parts Sourcing & Procurement: |
Do you want Rapid PCB to quote the sourcing and procurement of parts? If yes,
a separate quote will follow within 48 hours of receiving your complete
BOM and your rapid prototype design and manufacturing order. |
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Parts will be Provided by Customer: |
If yes,
components will be supplied and kitted by the customer. Kit will
include individual packages for each part type, clearly marked with
corresponding BOM item number, description and quantity of components
per package. |
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Rapid Prototype Quantity Option: |
Enter quantity desired. A Rapid PCB of turnaround and pricing options will follow once the quote is processed. |
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Schematic in Orcad or .PDF Format: |
A
schematic is required to understand the circuitry and produce an
accurate quote. Orcad or a .PDF of the schematic is the most common and
easiest for us to read. Other schematic formats are also acceptable as
long as readers are available to view them. |
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BOM in Excel or ASCII Text Format: |
A
bill of material is required to determine what parts are being used.
Excel or ASCII text format is easiest for us to process but other
common word processor or spreadsheet formats are also acceptable. The
BOM MUST contain the following information: (1)Item Number, (2)Quantity per Board, (3)Description with Detailed Value or Function Information, (4)Reference Designators and (5)Package Type. If parts are to be purchased, also include (6)Manufacturer, (7)Manufacturer Part Number and (8)Approved Vendors. |
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Board Outline Drawing with Dimensions: |
A
drawing with detailed dimensions is required. Additional information
such as locations for fixed component placement and keep out areas can
also be included. The drawing can be included in the Orcad schematic
drawing along with generla placement detials or other drawing formats
like AutoCad, are also acceptible. |
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Special instructions & requirements: |
Special instructions should include all other aspects of the board design and manufacturing that are of concern. In the absence of these instructions, best judgement assumptions will be made and included in your quote. |
